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GLOBAL TOP-TIER PARTNER, NEPES

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날짜 공시제목 제출인
2026-08-14 반기보고서 (2026.06) 네패스
2026-07-07 기업설명회(IR)개최 네패스
2026-06-30 주식등의대량보유상황보고서(일반) 이창우
2026-06-15 임원ㆍ주요주주특정증권등소유상황보고서 백종식
2026-06-08 임원ㆍ주요주주특정증권등소유상황보고서 백종식
2026-05-15 분기보고서 (2026.03) 네패스
2026-04-08 주식등의대량보유상황보고서(일반) 이창우
2026-04-08 임원ㆍ주요주주특정증권등소유상황보고서 이상호
2026-03-26 독립이사의선임ㆍ해임또는중도퇴임에관한신고 네패스
2026-03-26 본점소재지변경 네패스

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By Kim Bo-eun

Nepes, a leading firm in packaging and test services for semiconductors, have racked up a series a firsts in the parts and materials industry.

It became the first local company to commercialize fan-out wafer level packaging and also became the world's first company to commercialize panel-level packaging. In addition, it is the first in the industry to mass produce neuromorphic chips used to model the human brain.


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[원문보기 = The Korea Times  http://www.koreatimes.co.kr/www/tech/2021/03/129_305102.html]