Nepes Selected as Lead Demonstration Factory for Semiconductor AX Pilot Industrial Complex in Cheongju

■ Participates in Smart Green Industrial Complex AX Demonstration Project, Introducing AI into Semiconductor Packaging Processes

■ Collaborating with Chungcheongbuk-do and Cheongju City to Foster Cheongju as a Key Hub for Semiconductor AX Demonstration

Nepes, a leading semiconductor backend-processing specialist (Co-CEOs Byung-Koo Lee and Chang-Woo Lee), announced on Friday the 10th that it has been selected as the lead demonstration factory for Advanced Semiconductor Packaging Process AX (AI Transformation) under the “Smart Green Industrial Complex AX Demonstration Complex Development Project” promoted by the Ministry of Trade, Industry and Energy (MOTIE).

This large-scale AX transformation initiative is being carried out in collaboration with Chungcheongbuk-do Province, Cheongju City, the Chungbuk Branch of the Korea Industrial Complex Corporation (KICOX), and Chungbuk Technopark, with the goal of establishing Cheongju, North Chungcheong Province, as a key hub for semiconductor AX demonstration. The project will run through December 2029. As part of this initiative, Nepes will undertake the AX Lead Demonstration Factory project.

Through this project, Nepes plans to build a Data Lake that integrates manufacturing, process, equipment, inspection, and quality data, and to develop AI models for yield prediction and defect forecasting based on the integrated data platform. Beyond simply developing AI models, the company aims to evolve the system into a package-type process optimization AX platform equipped with comprehensive capabilities including analysis, prediction, recommendation, and simulation.

Jeon Deok-ho, Head of the AI Innovation Team at Nepes, said, “The essence of AX is ultimately about creating tangible changes that can be felt on the manufacturing floor. Through this AX Lead Demonstration Factory project, we will accelerate our transition toward process optimization-driven AX and translate it into meaningful outcomes that strengthen the competitiveness of semiconductor backend manufacturing.”