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BUSINESS

GLOBAL TOP-TIER PARTNER, NEPES

Wafer Level Package (WLP)

웨이퍼를 자르지 않고 범핑과 재배선(RDL) 하는 기술로,
칩의 경박단소를 위한 최적의 첨단 패키징 솔루션입니다.

Wafer Level Packaging Solutions

  • RDL
  • Bumping
  • Wafer Test
  • Back Grinding & Sawing
  • Final Product

nepes Wafer Level Package (WLP) portfolio meets the dramatic demand with full turn-key solutions.
The current product applications are power management IC, Codec, Touch screen controllers, DDI, System ICs in Mobile and Automotive.

Product View

VALUE FIWLP
Product View
Wafer Size 200mm & 300mm
Features

[Fan-in WLP]

[None-UBM Fan-in WLP]

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